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Title:
ウェーハの評価方法及びウェーハの研磨方法
Document Type and Number:
Japanese Patent JP5867359
Kind Code:
B2
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Inventors:
Kazuya Sato
Yuki Tanaka
Shuichi Kobayashi
Application Number:
JP2012222326A
Publication Date:
February 24, 2016
Filing Date:
October 04, 2012
Export Citation:
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Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L21/66; B24B37/04; H01L21/304
Domestic Patent References:
JP6275584A
JP2001239459A
Attorney, Agent or Firm:
Mikio Yoshimiya



 
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