Title:
管群構造ボイラ
Document Type and Number:
Japanese Patent JP5872146
Kind Code:
B2
Inventors:
Hiroshi Takashima
Shigeru Kuroki
Shigeru Kuroki
Application Number:
JP2010198138A
Publication Date:
March 01, 2016
Filing Date:
September 03, 2010
Export Citation:
Assignee:
Samsung Co., Ltd.
International Classes:
F22B21/04; F22B37/10; F28F1/32
Domestic Patent References:
| JP11193902A | ||||
| JP6074409A | ||||
| JP6094203A | ||||
| JP2000356302A | ||||
| JP10267202A | ||||
| JP2000065306A |