Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ハニカム構造体及びハニカム構造体の製造方法
Document Type and Number:
Japanese Patent JP5875997
Kind Code:
B2
Abstract:
There is disclosed a honeycomb structure in which cracks are not easily generated at canning and during use. The honeycomb structure includes a honeycomb structure part having porous partition walls 5, and porous plugged portions 8, and when in a cross section of each of the plugged portions 8 which is parallel to an extending direction of cells 4 of the honeycomb structure part, there is drawn a straight line as an inner boundary line K1 which is positioned at a distance of 30% of a distance between an outer end surface 11 and an inner end surface 13, from the inner end surface 13 as the end surface on a side opposite to the outer end surface 11 as the end surface on a side of the end surface of the honeycomb structure part, and which is perpendicular to the extending direction of the cells 4, and there is drawn a straight line as an outer boundary line K2 which is positioned at a distance of 70% of the distance between the outer end surface 11 and the inner end surface 13, from the inner end surface 13, and which is perpendicular to the extending direction of the cells 4, each of the plugged portions has an outer region 15 which is the region between the outer end surface 11 and the outer boundary line K2, and an inner region 17 which is the region between the inner end surface 13 and the inner boundary line K1 and whose porosity is larger than a porosity of the outer region 15.

Inventors:
Yusuke Tsuchiya
Hiroyuki Suenobu
Application Number:
JP2013028465A
Publication Date:
March 02, 2016
Filing Date:
February 15, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
B01D39/20; B01D46/00; F01N3/02; F01N3/022
Domestic Patent References:
JP2006272072A
JP2004154692A
Foreign References:
WO2007111175A1
WO2004052502A1
US20080197534
US20090011180
WO2011040145A1
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike



 
Previous Patent: フリップフロップ回路

Next Patent: JPS5875998