Title:
ＬＥＤワイヤを備える隣接した領域の製造方法およびその製造方法により得られる装置
Document Type and Number:
Japanese Patent JP6370305
Kind Code:
B2
Abstract:
A process for producing at least two adjacent regions, each comprising an array of light-emitting wires connected together in a given region by a transparent conductive layer, comprises: producing, on a substrate, a plurality of individual zones for growing wires extending over an area greater than the cumulative area of the two chips; growing wires in the individual growth zones; removing wires from at least one zone forming an initial free area to define the arrays of wires, the initial free area comprising individual growth zones level with the removed wires; and depositing a transparent conductive layer on each array of wires to electrically connect the wires of a given array of wires, each conductive layer being separated from the conductive layer of the neighbouring region by a free area. A device obtained using the process of the invention is also provided.
Inventors:
Purquier, Erik
Bono, Hubert
Bono, Hubert
Application Number:
JP2015548643A
Publication Date:
August 08, 2018
Filing Date:
December 20, 2013
Export Citation:
Assignee:
Aredia
Komisariya a Renergi Atomic E o Energy Alternate
Komisariya a Renergi Atomic E o Energy Alternate
International Classes:
H01L33/08; H01L21/205; H01L33/06
Domestic Patent References:
| JP2009094228A | ||||
| JP2011527519A | ||||
| JP2009010012A | ||||
| JP2011036995A |
Foreign References:
| WO2011020959A1 | ||||
| US20120205614 | ||||
| WO2009009612A1 | ||||
| WO2010044129A1 | ||||
| US20080210956 |
Attorney, Agent or Firm:
Kawaguchi International Patent Office