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Title:
付加硬化型シリコーン樹脂組成物、及び半導体装置
Document Type and Number:
Japanese Patent JP6389145
Kind Code:
B2
Inventors:
Tomoyuki Mizunashi
Takayuki Kusunoki
Takamizawa Yusuke
Application Number:
JP2015114428A
Publication Date:
September 12, 2018
Filing Date:
June 05, 2015
Export Citation:
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Assignee:
SE TYLOSE GMBH & CO.KG
International Classes:
C08L83/07; C01B33/149; C01G25/02; C08K3/16; C08K3/22; C08K3/36; C08K5/54; C08K9/06; C08L83/06; H01L23/29; H01L23/31
Domestic Patent References:
JP2014125401A
JP2014031436A
JP2005310756A
JP2014196216A
JP2015052027A
JP2013216849A
JP2011246693A
Foreign References:
WO2012115139A1
WO2012161157A1
WO2014208619A1
Attorney, Agent or Firm:
Mikio Yoshimiya



 
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