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Patent Searching and Data


Title:
セラミック接合体
Document Type and Number:
Japanese Patent JP6462807
Kind Code:
B2
Inventors:
Kiyotaka Nakamura
Application Number:
JP2017172198A
Publication Date:
January 30, 2019
Filing Date:
September 07, 2017
Export Citation:
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Assignee:
Kyocera Corporation
International Classes:
C04B37/00
Domestic Patent References:
JP6208512B2
JP5148048A
JP57042580A
JP63159263A
JP5148049A
JP5148047A
Foreign References:
FR2538370A1