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Patent Searching and Data


Title:
単結晶半導体層、自立基板及び積層構造体の製造方法
Document Type and Number:
Japanese Patent JP6530905
Kind Code:
B2
Inventors:
石原 裕次郎
住田 行常
錦織 豊
Application Number:
JP2014230448A
Publication Date:
June 12, 2019
Filing Date:
November 13, 2014
Export Citation:
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Assignee:
古河機械金属株式会社
International Classes:
C30B29/38; C30B25/16; H01L21/205
Domestic Patent References:
JP2003069156A
JP11026383A
JP2013080776A
JP2014090169A
Foreign References:
WO2014152605A1
Attorney, Agent or Firm:
速水 進治