Title:
基板浮上搬送装置
Document Type and Number:
Japanese Patent JP6605871
Kind Code:
B2
Abstract:
The present invention provides a substrate suspending carrier apparatus, which can maintain a fixed flatness rate of a wide substrate and convey the wide substrate at the same time. The substrate suspending carrier apparatus includes: a suspending stage unit, which is extended in a conveying direction and suspends the substrate on a substrate suspending surface; and a substrate holding unit, which holds the substrate suspended on the substrate suspending surface. As the substrate holding unit moves in the conveying direction while holding the substrate suspended on the substrate suspending surface, the substrate is conveyed while being suspended on the substrate suspending surface. A secondary suspending support unit is configured between the suspending stage unit and the substrate holding unit to suspend the emptied area of a wide surface created by emptying the substrate suspending surface in the widthwise direction when conveying the wide substrate of which a size in the widthwise direction perpendicular to the conveying direction is greater than that of a conventionally sized substrate.
Inventors:
Takeshi Hamakawa
Daisuke Okuda
Toshihiro Mori
Okamoto
Daisuke Okuda
Toshihiro Mori
Okamoto
Application Number:
JP2015153105A
Publication Date:
November 13, 2019
Filing Date:
August 03, 2015
Export Citation:
Assignee:
Toray Engineering Co., Ltd.
International Classes:
H01L21/677; B65G49/06; B65G51/03
Domestic Patent References:
| JP2011114169A | ||||
| JP2006206324A | ||||
| JP6163667A |
Foreign References:
| WO2014132339A1 |