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Patent Searching and Data


Title:
フレキシブルポリイミド基板の製造方法
Document Type and Number:
Japanese Patent JP6661206
Kind Code:
B2
Abstract:
To provide a solution for coating, capable of obtaining a PI film having an even thickness without generating orange peel even when shortening the time in drying and heat-curing a PAA (polyamic acid) coated film.SOLUTION: The solution for coating is used for a flexible polyimide substrate for forming an electronic device selected from a liquid crystal display, a plasma display panel, an organic EL display, and electronic paper, having following characters: 1) it comprises a PAA (polyamic acid) and an amide solvent, and as the constituents of the PAA, used are 3,3',4,4'-biphenyltetracarboxylic acid anhydride (BPDA), and p-phenylenediamine; 2) the solid content concentration of PAA is 16 mass% or more and 25 mass% or less relative to a solution mass; and 3) the solution viscosity at 25°C is 2 Pa s or higher and 200 Pa s or lower.SELECTED DRAWING: None

Inventors:
Yousuke Sugimoto
Yumi Yamada
Takeshi Yoshida
Akira Shigeta
Yoshiaki Echigo
Application Number:
JP2019147652A
Publication Date:
March 11, 2020
Filing Date:
August 09, 2019
Export Citation:
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Assignee:
UNITIKA LTD.
International Classes:
C03C17/32; C08G73/10; C09D179/08; G02F1/1333
Domestic Patent References:
JP60063226A
JP2010202729A
JP11001614A
JP2016062965A
JP2012035583A
JP2009091573A
JP2010168517A
Foreign References:
WO2012173204A1
WO2011145696A1