Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
基板搬送方法及び基板処理システム
Document Type and Number:
Japanese Patent JP6663774
Kind Code:
B2
Abstract:
Provided is a substrate transferring method which is capable of accurately mounting a substrate at a desired rotation angle. In order to eliminate a misalignment of a wafer W in a rotational direction in a vacuum process chamber, which is caused by a variation in a transfer distance of the wafer W, the wafer W is mounted on a stage while being offset from the center of the stage in a load lock chamber and an angle of rotation of the wafer W with respect to a fork when a transfer arm receives the wafer W is changed.

Inventors:
Keisuke Kondo
Application Number:
JP2016068041A
Publication Date:
March 13, 2020
Filing Date:
March 30, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/677; B25J13/08; B65G49/07
Domestic Patent References:
JP2010199478A
JP4290455A
JP2014522743A
Attorney, Agent or Firm:
Another role Shigehisa
Satoshi Muramatsu