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Title:
半導体装置の製造方法および端子固定治具
Document Type and Number:
Japanese Patent JP6683141
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To suppress the failure that a tip part of each of a plurality of press-fit terminals is difficult to insert into a hole part of a control substrate.SOLUTION: A manufacturing method of a semiconductor device comprises preparation steps (steps S100 and S102) of preparing an assemble component having a housing, a semiconductor chip arranged in an opening of the housing, and a plurality of press-fit terminals that includes a tip terminal and a root part, and in which the root part is connected to the housing; a terminal fixing step (step S104) of fixing the tip part after the preparation steps, in a state where the opening of the housing is opened by attaching a terminal fixture having a plurality of tip fixture holes for fitting each tip part of the plurality of press-fit terminals to the assembly component; a potting step (step S106) of charging a thermoset resin into the opening of the housing after the terminal fixing step; a heating step (step S108) of hardening the thermoset resin after the potting step by heating the assembly component; and a jig detachment step (step S112) of detaching the terminal fixture after the thermoset resin heated in the heating step has cooled.SELECTED DRAWING: Figure 12

Inventors:
萩原 貴嗣
籾井 真介
Application Number:
JP2017005309A
Publication Date:
April 15, 2020
Filing Date:
January 16, 2017
Export Citation:
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Assignee:
三菱電機株式会社
International Classes:
H01L23/04
Domestic Patent References:
JP2016219386A
JP2009117053A
JP2010267775A
JP2015207582A
JP2016219778A
Attorney, Agent or Firm:
高田 守
高橋 英樹
久野 淑己



 
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