Title:
半導体装置
Document Type and Number:
Japanese Patent JP6686048
Kind Code:
B2
Abstract:
This semiconductor device has: a plurality of memory chips provided with a first transmission/reception coil for communication by inductive coupling; and an interposer which is disposed at one end in a stacking direction along which the plurality of memory chips are stacked and provided with, for each of the plurality of memory chips, a second transmission/reception coil coupled with the first transmission/reception coil by inductive coupling. The larger the communication distance between the memory chips and the interposer, the larger the sizes of the first transmission/reception coil and the second transmission/reception coil. The first transmission/reception coil and the second transmission/reception coil may have sizes determined such that an induced electromotive force, which is generated in each of the memory chips by communication between the interposer and the memory chips, has a value within a common prescribed range.
Inventors:
Toshiji Ueda
Naoki Ogawa
Ryuji Takishita
Naoki Ogawa
Ryuji Takishita
Application Number:
JP2017562186A
Publication Date:
April 22, 2020
Filing Date:
January 18, 2016
Export Citation:
Assignee:
UltraMemory Co., Ltd.
International Classes:
H01L25/065; H01L25/07; H01L25/18; H04B5/02
Domestic Patent References:
| JP2009026792A | ||||
| JP2011081883A | ||||
| JP2011086738A |
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Nobuhiro Sakuma
Hayashi Ichiyoshi
Nobuhiro Sakuma