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Title:
金型反転システム
Document Type and Number:
Japanese Patent JP6703769
Kind Code:
B2
Abstract:
To provide a mold reversing system that can carry out efficient separation and reversal when separating and reversing an upper mold from a mold set, for which mounting and support means for the mold set received by a mold reversing device from the outside can be omitted, and with which production costs can be reduced. Provided is a mold reversing system (S) having mold reversing device (1) for receiving, separating, and reversing 180 DEG a mold set (D), which includes an upper mold (D1) and a lower mold (D2), and a mold transport truck (70), the mold reversing device (1) being provided with: abase (10) having a pair of circular arc shaped rotating body support parts (11a, 11b) on both ends separated by a prescribed distance; a rotating body (20) that includes a pair of parallel rotating plates (20a, 20b) respectively supported so as to rotate freely on the pair of rotating body support parts (11a, 11b); a rotational drive mechanism (30) that can rotationally drive the rotating body (20); a top panel (50) provided in the upper part of the rotating body (20); a mold holding means (60) disposed raisably and lowerably on the lower side of the top panel (50) and capable of holding an upper mold or lower mold; and a mold raising and lowering means (62) provided on the top panel (50) and capable of driving the raising and lowering of the mold holding means (60). The mold transport truck (70) is constituted so as to be able to approach the mold receiving space (40) between the pair of rotating plates (20a, 20b) from a horizontal direction orthogonal to the center of the axis of rotation of the rotating body (20).

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Inventors:
Kitaura Ichiro
Kimura Seiji
Application Number:
JP2016253704A
Publication Date:
June 03, 2020
Filing Date:
December 27, 2016
Export Citation:
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Assignee:
PASCAL ENGINEERING CORPORATION
International Classes:
B21D37/04; B21D37/14
Domestic Patent References:
JP8229617A
JP2005169840A
JP58145316A
Attorney, Agent or Firm:
Toshio Okamura