Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
研磨システム
Document Type and Number:
Japanese Patent JP6703939
Kind Code:
B2
Abstract:
A multi-layered polishing pad arrangement includes a first polishing pad layer having a first top and a first bottom major surface, a second polishing pad layer having a second top and a second bottom major surface, and a coupling arrangement disposed between the first bottom surface and the second top surface. The thickness of each of the first and second polishing pad layer ranges between 0.125 mm and 10 mm.

Inventors:
Rug, Paul S.
Lehu, Duy K.
Application Number:
JP2016516918A
Publication Date:
June 03, 2020
Filing Date:
September 23, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
B24B37/22; B24B37/00; C09G1/02; C09K3/14; H01L21/304
Domestic Patent References:
JP2003504218A
JP2005294410A
JP2004514017A
JP2004034175A
JP2005146036A
Foreign References:
US20010044269
Attorney, Agent or Firm:
Taro Akazawa
Wakako Nomura
Tsukuda Seigen
Ryohei Yoshino