Title:
ダイボンディング装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6705668
Kind Code:
B2
Abstract:
The invention provides a chip mounting apparatus and a method of manufacturing a semiconductor device, and solves the problem that a chip mounting apparatus which conveys a substrate in an X direction, conveys a wafer in a Y direction, and drives a wafer ring in a predetermined motion range in the X and Y directions requires a space for conveying and driving so that the size of the apparatus cannot be reduced. The chip mounting apparatus comprises a wafer box for accommodating a wafer ring for holding a wafer, a substrate box for accommodating a substrate, a wafer table for fixing the wafer ring, a mounting table for carrying the substrate in order to mount a bare chip picked up from the wafer, and a mechanical arm which is provided with a multi-degree-of-freedom multi-joint mechanism and is used for transferring the wafer ring, the substrate and the bare chip.
Inventors:
Naoki Okamoto
Application Number:
JP2016048988A
Publication Date:
June 03, 2020
Filing Date:
March 11, 2016
Export Citation:
Assignee:
Fasford Technology Co., Ltd.
International Classes:
H01L21/52; H01L21/677
Domestic Patent References:
| JP2000114281A | ||||
| JP11354604A | ||||
| JP2014128855A |
Foreign References:
| WO2014157134A1 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation