Title:
ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜および電子装置
Document Type and Number:
Japanese Patent JP6707854
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition excellent in balance of processability, mechanical strength, and residual stress after curing.SOLUTION: The positive photosensitive resin composition of the present invention contains (A) an alkali-soluble resin containing structural units a1) and a2), (B) a photoacid generator, and (C) a phenol compound. (In the formulae, R, R, Rand Reach independently represent a hydrogen atom, a hydroxyl group, or a 1-30C organic group; Rrepresents a hydrogen atom or a 1-30C organic group; and nand nare each an integer of 0-2.)SELECTED DRAWING: Figure 1
More Like This:
Inventors:
Yuma Tanaka
Application Number:
JP2015247403A
Publication Date:
June 10, 2020
Filing Date:
December 18, 2015
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
G03F7/023; G03F7/004; G03F7/20
Domestic Patent References:
| JP2004190008A | ||||
| JP2018520222A |
Attorney, Agent or Firm:
Shinji Hayami