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Patent Searching and Data


Title:
パターン形成方法及び電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP6761430
Kind Code:
B2
Abstract:
Provided are a pattern forming method for obtaining a pattern which is excellent in etching resistance and in which occurrence of pattern collapse can be suppressed, and a method for manufacturing an electronic device including the pattern forming method. The pattern forming method includes a step of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition that contains a resin A having a repeating unit represented by General Formula (I) and a repeating unit represented by General Formula (BII), a step of exposing the film, and a step of developing the exposed film using a developer containing an organic solvent, to form a pattern.

Inventors:
Akihiro Kaneko
Tomotaka Tsuchimura
Hirano Osamu
Hideaki Tsubaki
Wataru Futashi
Application Number:
JP2017558915A
Publication Date:
September 23, 2020
Filing Date:
December 08, 2016
Export Citation:
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Assignee:
FUJIFILM Corporation
International Classes:
G03F7/038; C08F212/14; C08F220/28; G03F7/039; G03F7/20; G03F7/32; H01L21/027
Domestic Patent References:
JP2012032747A
JP2014232309A
JP2014041328A
JP2013080004A
JP2015147925A
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mitsuhashi