Title:
分散体及びプリント配線基板製造用基板
Document Type and Number:
Japanese Patent JP6767818
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a dispersion that can form a low-resistant wire on a low heat-resistant resin substrate, and a substrate for the production of a printed wiring board having a film formed using the same.SOLUTION: A dispersion has particles containing metal and/or metal oxide, and nonvolatile organic matter. The particles have a primary particle size of 5 nm or more and less than 100 nm, the nonvolatile organic matter contains nitrogen-containing organic matter, and the nonvolatile organic matter has a nitrogen content of 6 mass% or more and 55 mass% or less.SELECTED DRAWING: None
Inventors:
Hirotaka Oi
Application Number:
JP2016176934A
Publication Date:
October 14, 2020
Filing Date:
September 09, 2016
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
H01B1/22; C09K23/56; H01B1/20
Domestic Patent References:
| JP2007524199A | ||||
| JP2007327109A | ||||
| JP200781351A |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima
Naohisa Akashi
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima
Naohisa Akashi