Title:
急速硬化エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP6790078
Kind Code:
B2
Abstract:
Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100°C to about 130°C to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.
Inventors:
Aspin, ian
Application Number:
JP2018515362A
Publication Date:
November 25, 2020
Filing Date:
June 02, 2016
Export Citation:
Assignee:
Scitech Industrial Materials (Derby) Limited
International Classes:
C08G59/50; C08G59/24; C08J5/04
Domestic Patent References:
| JP2002187936A | ||||
| JP62198668A | ||||
| JP2014517126A | ||||
| JP2006143759A |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation