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Title:
熱硬化性樹脂組成物、これを用いたプリプレグ、樹脂付フィルム、積層板、プリント配線板及び半導体パッケージ、並びにイミド樹脂及びその製造方法
Document Type and Number:
Japanese Patent JP6819062
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in copper foil adhesiveness, low thermal expansion property, low curing shrinkage property, heat resistance (solder heat resistance), elastic modulus and moldability.SOLUTION: There is provided a thermosetting resin composition containing an aromatic amine compound having at least 2 primary amino groups in one molecule (A), an aliphatic amine compound having at least 2 primary amino groups in one molecule (B), a siloxane compound having at least 2 primary amino groups at a molecular terminal (C), a maleimide compound having at least 2 N-substituted maleimide groups in one molecule (D).SELECTED DRAWING: None

Inventors:
Yuma Yoshida
Kenichi Ohashi
Takashi Morita
Shuji Nomoto
Shin Takanezawa
Shinji Tsuchikawa
Hashimoto Shintaro
Application Number:
JP2016063895A
Publication Date:
January 27, 2021
Filing Date:
March 28, 2016
Export Citation:
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Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
C08G73/06; B32B5/02; B32B27/34; C08J5/24; C08K3/00; C08L21/00; C08L63/00; C08L79/08; H01L23/14; H05K1/03
Domestic Patent References:
JP2014019758A
JP2135227A
Foreign References:
WO2012099133A1
WO2011089922A1
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama