基板処理装置及び基板処理方法

Japanese Patent JP6865008

B2

Provided is a substrate processing apparatus and a substrate processing method capable of improving a replacement efficiency of replacing a processing liquid on a processed surface of a substrate with a volatile solvent. The substrate processing apparatus (10) of one embodiment includes a first nozzle (61) that supplies a processing liquid to a processed surface (Wa) of a rotating substrate (W); a second nozzle (71) that supplies a volatile solvent to the center of the processed surface (Wa) of the rotating substrate (W); and a first nozzle moving mechanism (62) which is operated as a position moving section that causes, under a condition in which the processing liquid is supplied from the first nozzle (61) to the center of the processed surface (Wa) of the substrate (W), a processing liquid supply position on the processing surface (Wa) of the substrate (W) to move from the center of the processed surface (Wa) of the substrate (W) to a position near the center, and also causes, under a condition that the processing liquid is supplied from the first nozzle (61) to a position near the center of the processed surface (Wa) of the substrate (W) and the volatile solvent is supplied from the second nozzle (71) to the center of the processed surface (Wa) of the substrate (W), the processing liquid supply position to move from the center of the processed surface (Wa) of the substrate (W) in an outward direction.

Sasahira Konosuke
Tsutomu Kikuchi
Koichi Higuchi
Toshihide Hayashi

JP2016194349A

April 28, 2021

September 30, 2016

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Shibaura Mechatronics Co., Ltd.

H01L21/304

JP2016082227A

Kiuchi Mitsuharu
Koichi Okuma
Katagiri Sadanori
Kanako Kiuchi
Misawa patent office

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