Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
研磨装置
Document Type and Number:
Japanese Patent JP6906312
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing device capable of detecting displacement of a center of a wafer with respect to a center of a holding table.SOLUTION: A polishing device includes: holding means (40) rotatably fitting a holding table (41) that has a holding surface (42) holding a wafer (W); polishing means (51) rotatably fitting a polishing pad (53), pressing the polishing pad against the wafer, and polishing the wafer; polishing feed means (61) performing polish-feeding of the polishing means in a direction perpendicular to the holding table; and press force measuring parts (91a, 91b) that are arranged in the polishing means or the holding means and measure press force by which to press the polishing pad against the wafer. There is provided determination means (71) which determines that the center of the wafer is displaced with respect to the center of the holding table in the case that a cyclic change synchronized with the rotation number of the holding table is present in press force measured by the press force measuring part during the polishing work.SELECTED DRAWING: Figure 2

Inventors:
Kure
Application Number:
JP2017004807A
Publication Date:
July 21, 2021
Filing Date:
January 16, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Disco Co., Ltd.
International Classes:
B24B37/005; B24B37/10; B24B49/16; H01L21/304
Domestic Patent References:
JP2012152859A
JP2006066891A
JP7122524A
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki



 
Previous Patent: 空気調和装置

Next Patent: 歯ブラシ