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Title:
加工装置及びそれを用いた加工方法
Document Type and Number:
Japanese Patent JP6943693
Kind Code:
B2
Abstract:
To provide a processing device that can perform both cutting processing and honing processing alone, is small-sized and does not require a complicated structure.SOLUTION: The processing device, in which a cutting processing unit 6 having a cutting grindstone 65 and a honing processing unit 7 having a honing grindstone 75 are provided in parallel, comprises a tool table 41 that can move in a Z-direction, and further comprises a work table 52 that supports a work-piece W rotatably and feeds the work-piece W in an X-direction so that the work-piece is positioned at a cutting processing position and at a honing processing position. After rotating the work-piece W and the cutting grindstone 65 to subject the work-piece to the cutting processing, the work-piece W is fed to the honing processing position and then subjected to honing processing by rotating the work-piece W and enlarging the diameter of the honing grindstone 75 while rotating the grindstone in the opposite direction of the work-piece W.SELECTED DRAWING: Figure 1

Inventors:
Shoji Aoki
Naoki Koura
Application Number:
JP2017171045A
Publication Date:
October 06, 2021
Filing Date:
September 06, 2017
Export Citation:
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Assignee:
Toyo Advanced Technologies Co., Ltd.
International Classes:
B24B33/02; B24B5/08
Domestic Patent References:
JP2284865A
JP59110552A
Attorney, Agent or Firm:
Maeda patent office