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Patent Searching and Data


Title:
はんだ合金
Document Type and Number:
Japanese Patent JP7025208
Kind Code:
B2
Abstract:
In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by the solder, the present invention provides a solder alloy that comprises 2.0-4.0 mass % of Ag, 0.5-1.0 mass % of Cu, 0.1-1.0 mass % of Sb, 0.1-0.5 mass % of an additive element selected from the group consisting of Ca, Mn, and Al, and a balance of Sn.

Inventors:
Yuki Hyakukawa
Application Number:
JP2017518740A
Publication Date:
February 24, 2022
Filing Date:
April 25, 2016
Export Citation:
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Assignee:
NEC
International Classes:
B23K35/26; B23K35/22; C22C13/00; H05K3/34
Domestic Patent References:
JP200831550A
Foreign References:
US5527628
Attorney, Agent or Firm:
Desk
Keiji Kitajima