Title:
基板処理装置
Document Type and Number:
Japanese Patent JP7055839
Kind Code:
B2
Abstract:
To provide a substrate processing apparatus capable of successfully dehydrating a substrate.SOLUTION: A substrate processing apparatus according to an embodiment comprises: a first gas blowout part 30a provided above a substrate transfer path, for blowing out gas toward the substrate transfer path; a second gas blowout part 30b provided below the substrate transfer path, for blowing out gas toward the substrate transfer path; a transfer part 40 which has transfer shafts 42 each divided so as not to block the gas blown out by the second gas blowout part 30b and transfers a substrate W along the substrate transfer path; auxiliary rollers 50 which are provided correspondingly to positions where the transfer shafts 42 are divided and which are rotated by the substrate W transferred by the transfer part 40 to move on the substrate transfer path, for supporting the substrate W moving on the substrate transfer path; and an anti-scattering mechanism 60 for preventing scattering of a liquid adhering to the auxiliary roller 50.SELECTED DRAWING: Figure 3
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Inventors:
Keigo Omori
Application Number:
JP2020109523A
Publication Date:
April 18, 2022
Filing Date:
June 25, 2020
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
B08B5/02; F26B5/14; F26B13/04; F26B13/10; H01L21/304
Domestic Patent References:
| JP2000283652A | ||||
| JP2003176982A | ||||
| JP2006024696A | ||||
| JP2006278859A |
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