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Patent Searching and Data

Document Type and Number:
Japanese Patent JP7137227
Kind Code:
To provide a preforming apparatus and a preforming method capable of facilitating the formation of a preform, and reducing restrictions on resin types that can be formed.SOLUTION: A preforming apparatus 5 forms a preform 2 used for molding a resin molding 1. The preforming apparatus 5 is provided with: a stage frame 51, a stage 52 that moves up and down relative to the stage frame 51 to form a granular material layer 21 formed of granular materials 211 having a maximum outer diameter within a range of 0.5 to 5 mm; a light irradiation source 53 that irradiates the granular material layer 21 on the stage 52 with the convergent light G; and control equipment for controlling so as to repeatedly and alternately perform lamination of the granular material layer 21 and irradiation of the convergent light G. The control equipment controls an irradiation state of the convergent light G toward the granular material layer 21 so that surface portions of the granular material 211 in the granular material layer 21 are molten, and interfaces at which the surface portions come into contact, are bonded to each other to form a granular material bonded body as the preform.SELECTED DRAWING: Figure 2

Fumio Kurihara
Shingo Kagawa
Application Number:
Publication Date:
September 14, 2022
Filing Date:
February 25, 2020
Export Citation:
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Micro-AMS Co., Ltd.
International Classes:
B29C64/153; B29C39/24; B29C39/38; B29C64/214; B29C64/268; B29C64/393; B29C69/00; B33Y10/00; B33Y30/00; B33Y50/02
Domestic Patent References:
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office