Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP7222320
Kind Code:
B2
Abstract:
Provided is a resin composition capable of obtaining a cured product having excellent heat resistance and crack resistance. The resin composition comprises (A) an epoxy resin, (B) an inorganic filler, and (C) a non-reactive phosphazene compound, wherein the content of the component (C) is 0.2 to 1.0 mass% when a nonvolatile component in the resin composition is 100 mass%.
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Inventors:
Kenji Kawai
Application Number:
JP2019117846A
Publication Date:
February 15, 2023
Filing Date:
June 25, 2019
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; B32B27/38; C08K3/013; C08K3/36; C08K5/10; C08K5/29; C08K5/5399; H05K1/03
Domestic Patent References:
| JP2019085494A | ||||
| JP2014053400A | ||||
| JP2014159555A | ||||
| JP2016204419A | ||||
| JP2018131619A |
Foreign References:
| WO2013111697A1 |
Attorney, Agent or Firm:
Sakai International Patent Office
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