Document Type and Number:
Japanese Patent JPH0342688
Kind Code:
B2
Abstract:
PURPOSE:To increase water resistance by impregnating resin consisting of bisphenol type epoxy, a reactive diluent and an amine series curing agent into a winding wherein polyamide fiber having specified quantity of airflow is applied as a main insulation and curing it. CONSTITUTION:A flat type electrical wire is used as a conductor 5 and a turn insulation layer 6 is made by winding an assembled mica tape which is made to a backing by thermally melt-sticking aromatic polyamide paper on an assembled mica foil mixed with 9wt% aromatic polyamide fibrid. As a main insulation layer 7, a tape consisting of polyamide paper having 81.4g/m<2> area yield and density of <=25sec/100cm<3> quantity of airflow is lap-wound on a coil of the conductor 5. Iron core 2 is inserted into a coil 1 and fixed by using a wedge 3 and the spacers 4 and after connection, the coil 1 is subjected to vacuum pressurizing impregnation by using epoxy resin and then polymerization and curing are performed.
Application Number:
JP26380985A
Publication Date:
June 28, 1991
Filing Date:
November 26, 1985
Export Citation:
International Classes:
B32B5/28; B01F13/08; B22D11/10; B22D11/115; B32B1/00; B32B7/02; B32B15/02; B32B15/08; H01F5/06; H02K3/32; H02K3/44; H02K44/06
Next Patent: JPH0342689