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Patent Searching and Data


Title:
ABRASIVE CLOTH AND POLISHING METHOD
Document Type and Number:
Japanese Patent JPH08229805
Kind Code:
A
Abstract:

PURPOSE: To effectively use abrasives without scratching owing to loading of chips and make a flat plane with more accurate flatness.

CONSTITUTION: Many densely disposed holes 3 which can polish a wafer 5 at a high polishing rate are disposed in the middle part of an abrasive cloth 1 and grooves 2 through which the abrasives pass are disposed in the inner and the outer sides of the abrasive cloth 1. By rotating the abrasive cloth 1 and by rotating the wafer itself and further oscillating it in the radial direction, the abrasives poured in the middle part of the abrasive cloth are smoothly moved from the inner side to the outer side of the abrasive cloth and chips cut by the polishing part in the middle part of the abrasive cloth are ejected to the outside of the abrasive cloth without remaining.


Inventors:
SUZUKI MIEKO
Application Number:
JP4021295A
Publication Date:
September 10, 1996
Filing Date:
February 28, 1995
Export Citation:
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Assignee:
NEC CORP
International Classes:
B24B37/20; B24B37/24; B24B37/26; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)