PURPOSE: To effectively use abrasives without scratching owing to loading of chips and make a flat plane with more accurate flatness.
CONSTITUTION: Many densely disposed holes 3 which can polish a wafer 5 at a high polishing rate are disposed in the middle part of an abrasive cloth 1 and grooves 2 through which the abrasives pass are disposed in the inner and the outer sides of the abrasive cloth 1. By rotating the abrasive cloth 1 and by rotating the wafer itself and further oscillating it in the radial direction, the abrasives poured in the middle part of the abrasive cloth are smoothly moved from the inner side to the outer side of the abrasive cloth and chips cut by the polishing part in the middle part of the abrasive cloth are ejected to the outside of the abrasive cloth without remaining.