Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2007146112
Kind Code:
A
Abstract:
To provide a new adhesive composition promoting bonding reaction between an adherend and an adhesive composition and further enhancing adhesive force.
The adhesive composition comprises (A) a conjugated diene-based polymer having at least one functional group having a photo-curable unsaturated hydrocarbon group at a chain end, (B) a polymerizable compound, (C) a metal and/or metal compound and (D) a photopolymerization initiator.
Inventors:
SUGI SHINICHIRO
SATO KENJI
KITAMURA YUJI
SATO KENJI
KITAMURA YUJI
Application Number:
JP2006216117A
Publication Date:
June 14, 2007
Filing Date:
August 08, 2006
Export Citation:
Assignee:
BRIDGESTONE CORP
International Classes:
C09J4/00; C08F290/04; C09J4/06; C09J11/04; C09J11/06
Attorney, Agent or Firm:
Tamotsu Otani