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Patent Searching and Data


Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPH05148477
Kind Code:
A
Abstract:

PURPOSE: To provide an adhesive composition composed of a specific epoxy resin, diaminodiphenylsulfone and an inorganic filler at specific ratios, having long life and excellent moisture-resistance and reliability and useful for the air-tight sealing of an optical window of a solid-state image-pickup apparatus, etc.

CONSTITUTION: The objective adhesive composition contains, as essential components, (A) a bisphenol A epoxy resin derived from bisphenol A and epichlorohydrin, taking solid state at ordinary temperature and having a softening point of 50-130°C, (B) diaminodiphenylsulfone and (C) 5-80wt.% (based on A+B+C) of an inorganic filter such as silica.


Inventors:
OZAWA SATORU
MIZUNO MASUO
Application Number:
JP31566891A
Publication Date:
June 15, 1993
Filing Date:
November 29, 1991
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C09K3/10; C09J163/00; G03C3/00; (IPC1-7): C09J163/00; C09K3/10; G03C3/00