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Patent Searching and Data


Title:
ADHESIVE FILM FOR SEMICONDUCTOR USE AND SEMICONDUCTOR DEVICE USING THIS FILM
Document Type and Number:
Japanese Patent JP2006100784
Kind Code:
A
Abstract:

To provide an adhesive film for a semiconductor use capable of an adhesion at a low temperature of a semiconductor element and a support part for mounting the semiconductor element like a lead frame or the like.

The adhesive film for the semiconductor use consists of (A) a thermoplastic resin, (B) a epoxy resin having a softening point over 40°C and under 70°C, (C) the epoxy resin having a softening point over 70°C and under 100°C, and (D) the resin composition containing a phenol resin having a softening point over 80°C and under 130°C.


Inventors:
YASUDA HIROYUKI
NAKAGAWA DAISUKE
Application Number:
JP2005000184145
Publication Date:
April 13, 2006
Filing Date:
June 23, 2005
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
H01L21/52; C09J7/00; C09J133/06; C09J161/06; C09J163/00
Attorney, Agent or Firm:
速水 進治