Title:
ADHESIVE MATTER REMOVAL DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2020131537
Kind Code:
A
Abstract:
To remove adhesive matter generated around a molten resin strand 100 discharged from a die 10 or around a discharge hole 12 of the die 10 sufficiently in a short time.SOLUTION: An adhesive matter removal device removes adhesive matter generated around a molten resin strand 100 discharged from a discharge hole 12 formed on a discharge surface 11 of a die 10 and/or around the discharge hole 12. The adhesive matter removal device includes jetting means for jetting a gas so that a gas stream with an intensity varying temporally and/or spatially hits around the discharge hole 12 so as to remove the adhesive matter. The jetting means includes drive means capable of controlling a nozzle 1 jetting the gas and the position and/or direction of the nozzle 1. The drive means drives so that the nozzle 1 exercises a predetermined operation about the position and/or the direction so that the gas stream with an intensity varying temporally and/or spatially hits around the discharge hole 12.SELECTED DRAWING: Figure 1
Inventors:
MOCHIZUKI MASATOSHI
YOSHINO YUTAKA
YOSHINO YUTAKA
Application Number:
JP2019027401A
Publication Date:
August 31, 2020
Filing Date:
February 19, 2019
Export Citation:
Assignee:
POLYPLASTICS CO
International Classes:
B29C48/25; B29B9/06; B29C48/30
Domestic Patent References:
| JP2011011459A | 2011-01-20 | |||
| JPH09254234A | 1997-09-30 | |||
| JPS4747951B1 |
Foreign References:
| WO2012131980A1 | 2012-10-04 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu