Title:
ADHESIVE TAPE FOR FIXING SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP3008623
Kind Code:
B2
Abstract:
PURPOSE: To provide the subject tape retaining rubber elasticity after irradiated with radiation rays, causing no breakage thereof due to deterioration, capable of substantial, uniform magnification of interelement space, also causing no breakage due to heat in pickup.
CONSTITUTION: The objective tape, a laminated film made up of (A) as center layer, an ionomer resin film layer obtained by intermolecular cross-linking of an ethylene-methacrylic acid copolymer with zinc ion, (B) a radiation-curable tack agent layer coated with a tack agent, and, on the opposite side, (C) a transfer-preventive layer. These layers are mutually laminated either directly or through an adhesive.
Inventors:
Hiroshi Nakayama
Kenji Mochiki
Eiji Shiramatsu
Shinichi Ishiwatari
Kazushige Iwamoto
Kenji Mochiki
Eiji Shiramatsu
Shinichi Ishiwatari
Kazushige Iwamoto
Application Number:
JP34885791A
Publication Date:
February 14, 2000
Filing Date:
December 05, 1991
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C09J7/02; C09J4/00; C09J123/26; C09J131/04; C09J175/14; H01L21/301; H01L21/68; H01L21/683; H01L21/78; (IPC1-7): C09J7/02; H01L21/301; H01L21/68
Domestic Patent References:
| JP598220A | ||||
| JP6317980A | ||||
| JP3121167A | ||||
| JP62141085A | ||||
| JP49118779A |