Title:
【発明の名称】電子装置
Document Type and Number:
Japanese Patent JP3094780
Kind Code:
B2
Abstract:
An electronic device comprises a substrate having electronic parts, electric conductive wires for electrically connecting between the electronic parts, a front surface on which the electronic parts and electric conductive wires are mounted, a reverse surface and at least one electronic part back portion opposite to the electronic parts; and at least one high thermal conductivity member, a thermal conductivity coefficient thereof being higher than that of the substrate, the high thermal conductivity member being connected to the electronic part back portion while the high thermal conductivity member is opposite to the electronic parts in a substrate width direction to decrease a difference in temperature between the electronic parts.
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Inventors:
Norio Nakazato
Shigeki Hirasawa
Shoji Masukawa
Heikichi Kuwahara
Shigeki Hirasawa
Shoji Masukawa
Heikichi Kuwahara
Application Number:
JP6688194A
Publication Date:
October 03, 2000
Filing Date:
April 05, 1994
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H05K7/20; H05K1/02; H05K1/18; (IPC1-7): H05K7/20; H05K1/02
Domestic Patent References:
| JP4255289A | ||||
| JP4256397A | ||||
| JP563385A | ||||
| JP3190570A | ||||
| JP379494U | ||||
| JP62162890U | ||||
| JP6083255U | ||||
| JP3106797U | ||||
| JP275738U | ||||
| JP2136388U |
Attorney, Agent or Firm:
Yasuo Sakuta