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Title:
AMORPHOUS SEMICONDUCTOR FORMATION METHOD AND THIN FILM TRANSISTOR
Document Type and Number:
Japanese Patent JPH0513440
Kind Code:
A
Abstract:

PURPOSE: To avoid the variation in the film characteristics of the tille amorphous semiconductor by a method wherein Ne gas is introduced together with a material gas.

CONSTITUTION: During the rapid formation step of an amorphous semiconductor film by plasma CVD process at the film formation pressure not exceeding 10-1Torr, Ne gas is led-in in addition to a material gas. On the other hand, a microwave-guide 23 is connected to the upper part of a vacuum vessel 21 through the intermediary of a quartz window 22 to introduce microwaves in the vacuum vessel 21 so that the gasses introduced through gas nozzles 24, 25 may be turned into a plasm by the electron cyclotron resonance 27 generated by a magnetic field coil 26. At this time, the amorphous semiconductor film is rapidly formed at lower film formation pressure by ECR microwave CVD process. Through these procedures, the amorphous semiconductor film receiving little damage can be rapidly formed thereby enabling the high film characteristics to be displayed when a TFT is composed using this film.


Inventors:
SAITO KATSUAKI
FUKUDA TAKUYA
OGAMI MICHIO
TANAKA MASAHIRO
WATANABE KUNIHIKO
Application Number:
JP16421691A
Publication Date:
January 22, 1993
Filing Date:
July 04, 1991
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C23C16/50; C23C16/511; H01L21/205; H01L21/336; H01L29/78; H01L29/786; (IPC1-7): C23C16/50; H01L21/205; H01L21/336; H01L29/784
Attorney, Agent or Firm:
Yukihiko Takada