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Title:
APPARATUS FOR PRODUCING REINFORCED LAMINATED PRINTED CIRCUIT BOARD MADE OF SYNTHETIC RESIN
Document Type and Number:
Japanese Patent JP2637379
Kind Code:
B2
Abstract:

PURPOSE: To obtain a laminated sheet high in thickness accuracy by introducing a curable resin sufficient to fill all of gaps within the vol. of a desired composite into the filament structure in a vacuum chamber and holding the filament structure between a pair of opposed surfaces at a predetermined interval during the curing of the resin.
CONSTITUTION: A mandrel 20 is perfectly immersed in a resin soln. 244 along with the spiral winding wound around the mandrel and, when the mandrel becomes a vacuum state by a pump 26, a semi-finished product is perfectly impregnated with a resin. A rod 266 is drawn up to take the mandrel 20 out of the resin soln. 244 and the excessive resin soln. is removed while a part of the remaining resin soln. is kept around the winding by its thixotropy. Piston- cylinder combination members 278, 280 are moved and the outer plates 270, 272 of a mold member are brought into contact with the stopper on the mandrel 20. The stopper determines the accurate thickness of a completed laminated sheet. In this state, the winding on the mandrel is heated.


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Inventors:
MEDNEY JONAS (US)
KLIMPL FRED E (US)
Application Number:
JP6110395A
Publication Date:
August 06, 1997
Filing Date:
March 20, 1995
Export Citation:
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Assignee:
COMPOSITECH LTD (US)
International Classes:
B29B15/10; B29B15/12; B29C53/56; B29C53/58; B29C53/76; B29C53/80; B29C70/06; B29C70/10; B29C70/16; B29C70/20; B29C70/34; B32B15/08; B32B5/12; B32B5/28; C08J5/24; H05K1/02; H05K1/03; H05K3/00; H05K3/36; H05K3/46; B29K105/08; B29L9/00; B29L31/34; (IPC1-7): B29C70/06; B32B5/28; C08J5/24; H05K1/02; H05K1/03; H05K3/00
Domestic Patent References:
JP6189032A
JP6040252A
JP472100B1
Attorney, Agent or Firm:
Yusuke Hiraki (2 outside)



 
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