To provide an apparatus for rubbing a substrate for performing a rubbing treatment at high yield and low cost, when performing the rubbing treatment on the substrate mounted on the palette, a palette for use in the apparatus, and a method of rubbing the substrate.
In the apparatus for performing the rubbing treatment to a substrate 3 by mounting the substrate 3 on a palette 5, in a manner that the horizontal or vertical direction of the substrate 3 is inclined by a prescribed angle against a direction of relative movement of the substrate 3 and a roller 2, the palette 5 has substrate sitting parts 10 having a plurality of columns and rows so as to mount the substrates 3 thereon, and positions in the column direction of the sitting parts 10 after the second column are mutually out of alignment in response to the prescribed angle.
TASAKA KAZUO
YAZAKI MASAYUKI
Fujitsuna Hideyoshi
Osamu Suzawa