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Patent Searching and Data


Title:
APPARATUS FOR RUBBING SUBSTRATE, PALETTE FOR USE IN THE APPARATUS, AND METHOD OF RUBBING THE SUBSTRATE
Document Type and Number:
Japanese Patent JP2004151344
Kind Code:
A
Abstract:

To provide an apparatus for rubbing a substrate for performing a rubbing treatment at high yield and low cost, when performing the rubbing treatment on the substrate mounted on the palette, a palette for use in the apparatus, and a method of rubbing the substrate.

In the apparatus for performing the rubbing treatment to a substrate 3 by mounting the substrate 3 on a palette 5, in a manner that the horizontal or vertical direction of the substrate 3 is inclined by a prescribed angle against a direction of relative movement of the substrate 3 and a roller 2, the palette 5 has substrate sitting parts 10 having a plurality of columns and rows so as to mount the substrates 3 thereon, and positions in the column direction of the sitting parts 10 after the second column are mutually out of alignment in response to the prescribed angle.


Inventors:
SEKI YOSHIHIRO
TASAKA KAZUO
YAZAKI MASAYUKI
Application Number:
JP2002316086A
Publication Date:
May 27, 2004
Filing Date:
October 30, 2002
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
G02F1/1337; (IPC1-7): G02F1/1337
Attorney, Agent or Firm:
Masahiko Ueyanagi
Fujitsuna Hideyoshi
Osamu Suzawa