Title:
AQUEOUS PHOTOSENSITIVE RESIN COMPOSITION AND MANUFACTURE OF PRINTED CIRCUIT BOARD USING IT
Document Type and Number:
Japanese Patent JP3040202
Kind Code:
B2
Abstract:
PURPOSE: To provide the photosensitive resin composition dissolved or dispersed in water and capable of forming a coat film developable with water or aqueous alkali after exposure and capable of forming an image.
CONSTITUTION: The aqueous photosensitive resin composition comprises a resin having carboxyl groups, an amine compound, a photopolymerizable unsaturated compound, a photopolymerization initiator, and water to be used for a solvent or a dispersion medium as an essential component, or in other cases, a resin having carboxyl groups and a polymerizable unsaturated bonds introduced into the molecule and/or an amine compound can be used in place of the photopolymerizable unsaturated compound or in combination with it.
Inventors:
Youshichi Hagiwara
Hiroshi Samukawa
Katsue Nishikawa
Hiroshi Samukawa
Katsue Nishikawa
Application Number:
JP17224791A
Publication Date:
May 15, 2000
Filing Date:
July 12, 1991
Export Citation:
Assignee:
W R GRACE & CO-CONN
International Classes:
C08F2/48; C08F290/00; C08F291/00; C08F299/00; C08J3/03; C08L101/00; C08L101/08; G03F7/027; G03F7/033; G03F7/038; H01L21/027; H05K3/06; (IPC1-7): G03F7/038; C08F2/48; C08F291/00; C08F299/00; C08J3/03; C08J3/075; C08L101/08; G03F7/027; G03F7/033; H05K3/06
Domestic Patent References:
| JP4294354A | ||||
| JP5140251A | ||||
| JP63257748A |
Attorney, Agent or Firm:
Kazuo Shamoto (4 outside)