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Patent Searching and Data


Title:
INPUT/OUTPUT ARCHITECTURES FOR MOUNTED PROCESSOR
Document Type and Number:
Japanese Patent JP2016006776
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide mounting substrates for processors, and input/output configurations for the mounting.SOLUTION: A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an integrated heat spreader footprint on a die side, and the I/O trace to couple with an IC device disposed inside the integrated heat spreader footprint. The I/O trace includes a pin-out terminal outside the integrated heat spreader footprint to couple to an IC device disposed outside the integrated heat spreader footprint. The I/O trace can sustain a data flow rate from a processor in the range from 5 gigabits per second (Gb/s) to 40 Gb/s.

Inventors:
GANESAN SANKA
AYGUN KEMAL
CHANDRASHEKHAR RAMASWAMY
ERIC PALMER
HENNING BRAUNISCH
Application Number:
JP2015146686A
Publication Date:
January 14, 2016
Filing Date:
July 24, 2015
Export Citation:
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Assignee:
INTEL CORP
International Classes:
H01R33/76; H01R12/51; H05K1/11; H05K3/46
Attorney, Agent or Firm:
伊東 忠重
伊東 忠彦
大貫 進介