ASSEMBLED UNIT IN WHICH INTEGRATED CIRCUIT DIE AND LEAD FRAME ARE MUTUALLY CONNECTED AND METHOD OF MUTUAL CONNECTION

Title:

ASSEMBLED UNIT IN WHICH INTEGRATED CIRCUIT DIE AND LEAD FRAME ARE MUTUALLY CONNECTED AND METHOD OF MUTUAL CONNECTION

Document Type and Number:

Japanese Patent JPS62259450

Kind Code:

A

Abstract:

In order to prevent bonding wire sag and to allow high lead count an insulative bridging member is provided between the ends of inner leads of a lead frame and a centrally mounted integrated circuit die. The bridging member (30) of annular square configuration has transverse plated spaced conductive pathways (31). A first series of short bonding wires (40) connect selected die contact pads to an inner end of selected conductive pathways and a second concentric series of bonding wires (41) connect an outer end of the selective conductive pathways of the bridging member to selected ones of the inner leads of the lead frame. The above elements except for outer leads of the lead frame are encapsulated to form an overall die package with external leads or pin contacts.

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Inventors:

ROBAATO ERU KAMUSUTOTSUKU
SUCHIIBUN ERU BABURETSUKU

Application Number:

JP10213387A

Publication Date:

November 11, 1987

Filing Date:

April 27, 1987

Export Citation:

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Assignee:

MONOLITHIC MEMORIES INC

International Classes:

H01L21/60; H01L23/495; H01L23/498; (IPC1-7): H01L21/60

Domestic Patent References:

JPS622628A	1987-01-08
JPS62165349A	1987-07-21

Attorney, Agent or Firm:

Kazuo Kobashi

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