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Patent Searching and Data


Title:
ASSEMBLING KIT FOR SOUND INSULATION STRUCTURE AND SOUND ABSORPTION UNIT
Document Type and Number:
Japanese Patent JP2021001565
Kind Code:
A
Abstract:
To provide a sound insulation structure which is easy in installation work, and high in versatility.SOLUTION: An assembling kit for a sound insulation structure comprises a plurality of sound insulation units 10, and a connecting member 40 for connecting a pair of sound insulation units 10 at an arbitrary angle. The sound insulation units 10 comprise sound insulation panels 11 each having a pair of sideway sides 11c and 11d which extend in a vertical direction, a long first support member 20 attached to one of the pair of sideway sides 11c and 11d of the sound insulation panel 11 and having an upwardly-opened first recess, and a long second support member 30 attached to the other one of the sideway sides 11d and 11c and having an upwardly-opened second recess. The connecting member 40 comprises an upper wall part, and a first shaft part and a second shaft part which extend downwardly from the upper wall part.SELECTED DRAWING: Figure 4

Inventors:
IWAI MASATO
Application Number:
JP2019114921A
Publication Date:
January 07, 2021
Filing Date:
June 20, 2019
Export Citation:
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Assignee:
GIFU PLASTIC IND CO LTD
International Classes:
F02B77/13; E04B1/343; F02B63/04; G10K11/16
Domestic Patent References:
JPS5018201U1975-02-28
JPH10266731A1998-10-06
JP2007334168A2007-12-27
Foreign References:
US20090014044A12009-01-15
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda