Title:
AUTOMATIC MOLDING DEVICE USING RELEASE FILM
Document Type and Number:
Japanese Patent JP3545507
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To carry out an automatic resin-molding by providing a conveyance mechanism for supplying a release film to a pressing mechanism part.
SOLUTION: A resin molding device is equipped with a pressing mechanism part A for applying an article to be molded to resin molding, the conveyance mechanisms B, C of a release film for supplying the release film 10 to the pressing mechanism part by fitting timing to resin molding operation in the pressing mechanism part A and the conveying in/out mechanism part of a product which transfers the article to be molded to the pressing mechanism part and also conveys out the product after resin molding from the pressing mechanism part. 1 The conveyance mechanism parts B, C of the release film newly supply the release film 10 to each top force 12 and bottom force 14 at every time of performing resin molding operation in a designated number of times in the pressing mechanism part A. The release film 10 after use is conveyed out from the top of the molding die and recovered. In the case of conveying the release film 10, conveyance of the release film 10 is stopped to perform resin molding in a plurality of numbers of times and thereafter conveyed.
Inventors:
Fumio Miyajima
Application Number:
JP21507895A
Publication Date:
July 21, 2004
Filing Date:
August 23, 1995
Export Citation:
Assignee:
Apic Yamada Corporation
International Classes:
B29C45/02; B29C33/68; B29C45/14; (IPC1-7): B29C45/02; B29C33/68; B29C45/14
Domestic Patent References:
| JP6120410A | ||||
| JP62148212A | ||||
| JP5144862A | ||||
| JP6238718A | ||||
| JP6244246A | ||||
| JP2072640A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu