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Title:
AUTOMATIC MOUNTING DEVICE FOR COMPONENTS
Document Type and Number:
Japanese Patent JP3223859
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain an automatic mounting device for components by which various parts can be easily and efficiently mounted to a substrate and highly reliable mounting structure for electronic components or electronic components can be provided because short-circuit or connection failure is hard to occur.
SOLUTION: This automatic mounting device 1 for components is provided with a component supply part 9, a bonding agent coating part 12 and a substrate placing part 18. A part 11 existing on the component supply part 9 is held by a suction head 4, and a bonding agent is coated thereto by the bonding agent coating part 12, and then the part 11 is mounted to the substrate placing part 18. The bonding agent coating part 12 is provided with a bonding agent tank 14 having a groove 14a in its inner bottom and a bonding agent accumulated in the tank 14, and the bonding agent surface of the groove 14a is lower than that of the other part, so that the bonding agent 17 can be given to the bottom surface of the part 11 in other parts which exclude the upper side of the groove 14a.


Inventors:
Koichi Nitta
Tetsuo Tatsumi
Michinobu Maesaka
Ken Taniguchi
Atsushi Hirakawa
Taku Ikeda
Application Number:
JP27730397A
Publication Date:
October 29, 2001
Filing Date:
October 09, 1997
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K13/04; H05K3/34; (IPC1-7): H05K3/34
Domestic Patent References:
JP6466998A
JP7193101A
JP63258033A
Attorney, Agent or Firm:
Miya Saki Main tax (1 person outside)