Title:
【発明の名称】基材セット方法及びそれに使用する基材セット装置
Document Type and Number:
Japanese Patent JP3359725
Kind Code:
B2
Inventors:
Hideo Yabuhara
Application Number:
JP2309894A
Publication Date:
December 24, 2002
Filing Date:
January 25, 1994
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B05D1/28; B05C1/00; B29C41/12; B29C41/20; B29C65/14; B29D11/00; B29D17/00; G11B7/26; B29L17/00; (IPC1-7): B29C41/20; B29C41/12; G11B7/26
Domestic Patent References:
| JP2184801A | ||||
| JP2118932A | ||||
| JP428033A | ||||
| JP423244A | ||||
| JP61235133A | ||||
| JP53116105A | ||||
| JP2203444A | ||||
| JP57163534A |
Attorney, Agent or Firm:
Ikuro Doi