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Patent Searching and Data


Title:
BLISTER PACK
Document Type and Number:
Japanese Patent JPH10114359
Kind Code:
A
Abstract:

To provide a blister pack with which a tray can be peeled off from a base board without peeling off the surface layer of the base board and also without leaving a part of the tray on the base board.

This blister pack 1 is constituted of a tray 2 provided with a containable recess for an article formed on a thermoplastic resin sheet which is transparent at least at a part thereof, a flange 4 formed at the peripheral edge of the recess, and a lug 5 attached to a part of the flange 4, and a base board 3 stuck on the flange 4 of the tray 2 to shelter the article contained in the recess. A plurality of adhesive parts 6 bonding the flange 4 to the base board 3 are dispersely arranged in series in the direction peeling respective adhesive parts 6 from the lug 5.


Inventors:
NAGASAKA SHIGEAKI
TAKEUCHI AKIFUMI
OTA TETSUO
HAYAKAWA YOKO
HAGITA KOJI
NAGATA JUNKO
Application Number:
JP26897096A
Publication Date:
May 06, 1998
Filing Date:
October 09, 1996
Export Citation:
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Assignee:
POLA CHEM IND INC
International Classes:
B65D75/36; B29D22/00; B32B7/14; B65D77/38; B29K105/32; (IPC1-7): B65D75/36; B29D22/00; B32B7/14; B65D77/38
Attorney, Agent or Firm:
Tsutomu Toyama (2 outside)