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Patent Searching and Data


Title:
BOARD-EQUIPPED ELECTRONIC COMPONENT AND METHOD OF RECOGNIZING ITS PACKAGE
Document Type and Number:
Japanese Patent JP2007019162
Kind Code:
A
Abstract:

To provide a board-equipped electronic component and a method of recognizing its package capable of inspecting a fixing state of an electronic component on a board by a conventional image-recognition package inspection device whatever its size is, and so of realizing secure fixing on the board.

There are provided a body with a bottom surface placed in opposition to a component placement surface of the board; and at least one protruded part protruding from the body in a direction parallel to the bottom surface of the body. The protruded part has a detection flat plane parallel to the bottom surface of the body at its end.


Inventors:
SEO SHINICHI
SOMAKI MOTOAKI
IWAZAWA TAKASHI
Application Number:
JP2005197602A
Publication Date:
January 25, 2007
Filing Date:
July 06, 2005
Export Citation:
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Assignee:
KEIHIN CORP
International Classes:
H01F27/06; H01F27/00; H05K1/18; H05K13/08
Attorney, Agent or Firm:
藤村 元彦