To provide a bonding device for bonding an electrode of a semiconductor die to an electrode of a circuit board with a reduced bonding load and a method for effectively bonding them together in a simple way.

A bonding device 10 for bonding an electrode of a semiconductor die 12 to an electrode of a circuit board 19 with a metal nano paste, includes: a bump formation mechanism 20 for injecting micro liquid drops of the metal nano paste onto the electrodes to form bumps; a primary bonding mechanism 50 for pressing the bump of the semiconductor die 12 against that of the circuit board 19 to primarily bond the electrodes together in a non-conductive state; and a secondary bonding mechanism 80 for pressing and heating the primarily bonded bumps in the bonding direction to subject metal nano particles of each of the bumps to pressure sintering and to secondarily bond the electrodes together in a conductive state.

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