Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BOTTOM TAPE ON CHIP COVER TAPE
Document Type and Number:
Japanese Patent JPH082587
Kind Code:
A
Abstract:

PURPOSE: To minimize man-uniformity in peeling strength of a top tape by applying conductivity to a bottom tape without applying antistatic property to the top tape.

CONSTITUTION: A bottom tape comprises a base material 1 with an adhesive layer 2 and a conductive film 3 laminated in this order, while the conductive film 3 is joined with a lower face of a carrier 4 into a single body. Paper such as paper made in a Western way, Japanese paper, chemical fiber paper or the like is preferably used as a material for the base material 1 from a viewpoint of easiness in formation of the conductive film, easiness in handling, etc. A thickness of the conductive film in a range of 0.1 to 1.5μm is suitable, while surface resistivity Q in a range of 103 to 108 is suitable and preferable. The carrier 4 receives a chip part 5 in a punched hole 6, while the top tape 7 is adhered on the carrier 4 by an adhesive layer 8. Since antistatic effects at the time of peeling the top tape 7 can thus be sufficiently performed by the conductive film 3 of the bottom tape, the most preferable adhesive material can be selected as the adhesive layer 8 of the top tape 7.


Inventors:
KAWAMURA SHUNICHI
Application Number:
JP16993194A
Publication Date:
January 09, 1996
Filing Date:
June 17, 1994
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIHON MATAI CO LTD
International Classes:
B65D73/02; B65D85/86; (IPC1-7): B65D85/86; B65D73/02
Attorney, Agent or Firm:
Nagasawa Yukio



 
Next Patent: LOCKING DEVICE