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Title:
BRAZING MATERIAL FOR HIGH TEMPERATURE SOLDERING AND SEMICONDUCTOR DEVICE USING IT
Document Type and Number:
Japanese Patent JP2005052869
Kind Code:
A
Abstract:

To provide a Pb-free brazing material which has superior wettability with a variety of conductive materials during die bonding of semiconductor elements and is suitable for high temperature soldering, and a semiconductor device using the brazing material, which is processed without any trouble in the successive assembly processes and is excellent in weathering resistance.

The brazing material for high temperature soldering comprises 25-80 wt% Sn, 0.001-1.0 wt% P and the balance being Zn and inevitable impurities, or comprises 25-80 wt% Sn, 0.001-1.0 wt% P, at least one element selected from Ge, Ag, Cu and In or Ni in amounts of 0.1-6 wt% respectively, and the balance being Zn and inevitable impurities. The semiconductor device using the brazing material is provided.


Inventors:
MORI NOBUMOTO
Application Number:
JP2003000287285
Publication Date:
March 03, 2005
Filing Date:
August 06, 2003
Export Citation:
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Assignee:
SUMITOMO METAL MINING CO
International Classes:
B23K35/26; B23K35/28; C22C13/00; H01L21/52; (IPC1-7): B23K35/26; B23K35/28; C22C13/00; H01L21/52
Attorney, Agent or Firm:
河備 健二